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--- report:dvp [2026/05/21 11:14] – [Packaging] team6
+++ report:dvp [2026/05/28 00:37] (current) – [Tests & Results] team6
@@ Line 68: / Line 68: @@
 == Structure Tests ==
-<color #ed1c24>Describe and add the load and stress analysis of the structure (3D model) using the materials chosen for the product.</color>
+Introduction
+To evaluate the structural performance of the cocoon design, a static simulation was performed in SOLIDWORKS, Figure {{ref>fig:stress}}. The cocoon was modeled using copper as the selected material. The analysis focused on the stress distribution and displacement behavior under the applied loads. The goal was to determine whether the structure is strong and rigid enough to withstand external forces without failure or excessive deformation.
+<WRAP centeralign>
+<figure fig:stress>
+{{ :report:simulation_cocoon.png?800 |}}
+<caption>Stress analysis</caption>
+</figure>
+</WRAP>
+Conclusion
+The simulation results show that the copper cocoon structure performs safely under the applied load conditions. The maximum stress remains far below the material yield strength, while the displacement is extremely small. This indicates that the design is highly rigid and experiences minimal deformation, confirming that the structure is mechanically stable and suitable for its intended use.
@@ Line 175: / Line 189: @@
 To achieve this, in addition to cardboard packaging, we want to use a single, effective type of cushioning material that can be used in all product packaging and is also reusable and biodegradable.
-Since our product is intended for children, our packaging will include cushioning material made from particles manufactured from cornstarch. These particles are an environmentally friendly and biodegradable alternative. Furthermore, they can later be used as craft material for children in the waiting room: with a little water, these particles stick together, allowing children to express their creativity and build structures and figures.
+Since our product is intended for children, our packaging will include cushioning material made from particles manufactured from cornstarch. These particles are an environmentally friendly and biodegradable alternative. Furthermore, they can later be used as craft material for children in the waiting room: with a little water, these particles stick together, allowing children to express their creativity and build structures and figures.\\
+\\
   - **Initial packaging drafts**
@@ Line 187: / Line 202: @@
 </figure>
 </WRAP>
+\\
   - **Detailed drawings**
@@ Line 208: / Line 224: @@
 </figure>
 </WRAP>
+\\
 __Hardware system box__:
@@ Line 218: / Line 235: @@
 <caption>Folding box template FEFCO 0427 - for hardware system</caption>
 </figure>
-</WRAP>
+</WRAP>\\
+  - **3D Model**
-  - 3D Model
+The Figure {{ref>fig:3Dsmallbox}} shows the 3D model of the system hardware box, which will be located inside the main box shown in the Figure {{ref>fig:3Dmainbox}}.
 <WRAP centeralign>
-<figure fig:3D_mainbox>
+<figure fig:3Dsmallbox>
-{{ :report:main_box_3d_logo_added.png?direct&400 |}}
+{{ :report:hardware_system_box_logo_added.png?direct&400 |}}
-<caption>3D model - main box</caption>
+<caption>3D model - hardware system box</caption>
 </figure>
 </WRAP>
 <WRAP centeralign>
-<figure fig:3D_ smallbox>
+<figure fig:3Dmainbox>
-{{ :report:hardware_system_box_logo_added.png?direct&400 |}}
+{{ :report:main_box_3d_logo_added.png?direct&400 |}}
-<caption>3D model - hardware system box</caption>
+<caption>3D model - main box</caption>
 </figure>
 </WRAP>
@@ Line 638: / Line 656: @@
 == Hardware tests ==
-Perform the hardware tests specified in [[report:intro#tests|Tests]]. These results are usually presented in the form of tables with two columns: Functionality and Test Result (Pass/Fail).
+Perform the hardware tests specified in [[report:intro#tests|Tests]]. These results are presented below in the form of table {{ref>}} with three columns: ID, Functionality and Test Result (Pass/Fail).
+<table tests>
+^ ID ^ Functionality ^ Status ^
+| FT-GY01 | GY-21 Baseline Calibration Read | Pass |
+| FT-GY02 | GY-21 Thermal Responsiveness | Pass |
+| FT-GY03 | GY-21 Humidity Saturation | Pass |
+| PT-GY01 | GY-21 Environmental Recovery Rate | Pass |
+| PT-GY02 | GY-21 I2C Polling Stress (50ms) |  |
+| FT-BH01 | BH1750 Lux Range Verification | Pass |
+| FT-BH02 | BH1750 Shadow Transient Detection | Pass |
+| PT-BH01 | BH1750 Continuous Light Exposure | Pass |
+| PT-BH02 | BH1750 High-Freq Transitions (10Hz) |  |
+| FT-MQ01 | MQ-135 Analog Voltage Baseline | Pass |
+| FT-MQ02 | MQ-135 VOC Spike Detection | Pass |
+| PT-MQ01 | MQ-135 48h Thermal Burn-in Drift |  |
+| PT-MQ02 | MQ-135 Dissipation Latency | Pass |
+| FT-WA01 | Atomizer Digital State Actuation | Pass |
+| FT-WA02 | Atomizer Capillary Wicking Action | |
+| PT-WA01 | Atomizer 1000 Duty Cycles Endurance |  |
+| PT-WA02 | Atomizer Driver Board Thermal Load | |
+| FT-SYS01 | System I2C Address Multiplexing | Pass |
+| PT-SYS01 | Power Supply Rail Voltage Stability |  |
+| PT-SYS02 | System End-to-End Latency | Pass |
+</table>
 == Software tests ==