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| Both sides previous revision Previous revision Next revision | Previous revision | ||
| report:dvp [2026/05/21 11:25] – [Packaging] team6 | report:dvp [2026/05/28 00:37] (current) – [Tests & Results] team6 | ||
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| == Structure Tests == | == Structure Tests == | ||
| - | <color #ed1c24>Describe | + | Introduction |
| + | |||
| + | To evaluate the structural performance of the cocoon design, a static simulation was performed in SOLIDWORKS, Figure {{ref>fig: | ||
| + | |||
| + | <WRAP centeralign> | ||
| + | <figure fig:stress> | ||
| + | {{ : | ||
| + | < | ||
| + | </ | ||
| + | </ | ||
| + | |||
| + | Conclusion | ||
| + | |||
| + | The simulation results show that the copper cocoon | ||
| Line 177: | Line 191: | ||
| Since our product is intended for children, our packaging will include cushioning material made from particles manufactured from cornstarch. These particles are an environmentally friendly and biodegradable alternative. Furthermore, | Since our product is intended for children, our packaging will include cushioning material made from particles manufactured from cornstarch. These particles are an environmentally friendly and biodegradable alternative. Furthermore, | ||
| \\ | \\ | ||
| - | |||
| - **Initial packaging drafts** | - **Initial packaging drafts** | ||
| Line 222: | Line 235: | ||
| < | < | ||
| </ | </ | ||
| - | </ | + | </ |
| - | \\ | + | |
| - **3D Model** | - **3D Model** | ||
| - | The figure | + | The Figure {{ref> |
| <WRAP centeralign> | <WRAP centeralign> | ||
| - | <figure fig:3D_ smallbox> | + | <figure fig:3Dsmallbox> |
| {{ : | {{ : | ||
| < | < | ||
| Line 237: | Line 249: | ||
| <WRAP centeralign> | <WRAP centeralign> | ||
| - | <figure fig:3D_mainbox> | + | <figure fig:3Dmainbox> |
| {{ : | {{ : | ||
| < | < | ||
| Line 644: | Line 656: | ||
| == Hardware tests == | == Hardware tests == | ||
| - | Perform the hardware tests specified in [[report: | + | Perform the hardware tests specified in [[report: |
| + | |||
| + | <table tests> | ||
| + | ^ ID ^ Functionality ^ Status ^ | ||
| + | | FT-GY01 | GY-21 Baseline Calibration Read | Pass | | ||
| + | | FT-GY02 | GY-21 Thermal Responsiveness | Pass | | ||
| + | | FT-GY03 | GY-21 Humidity Saturation | Pass | | ||
| + | | PT-GY01 | GY-21 Environmental Recovery Rate | Pass | | ||
| + | | PT-GY02 | GY-21 I2C Polling Stress (50ms) | | | ||
| + | | FT-BH01 | BH1750 Lux Range Verification | Pass | | ||
| + | | FT-BH02 | BH1750 Shadow Transient Detection | Pass | | ||
| + | | PT-BH01 | BH1750 Continuous Light Exposure | Pass | | ||
| + | | PT-BH02 | BH1750 High-Freq Transitions (10Hz) | | | ||
| + | | FT-MQ01 | MQ-135 Analog Voltage Baseline | Pass | | ||
| + | | FT-MQ02 | MQ-135 VOC Spike Detection | Pass | | ||
| + | | PT-MQ01 | MQ-135 48h Thermal Burn-in Drift | | | ||
| + | | PT-MQ02 | MQ-135 Dissipation Latency | Pass | | ||
| + | | FT-WA01 | Atomizer Digital State Actuation | Pass | | ||
| + | | FT-WA02 | Atomizer Capillary Wicking Action | | | ||
| + | | PT-WA01 | Atomizer 1000 Duty Cycles Endurance | | | ||
| + | | PT-WA02 | Atomizer Driver Board Thermal Load | | | ||
| + | | FT-SYS01 | System I2C Address Multiplexing | Pass | | ||
| + | | PT-SYS01 | Power Supply Rail Voltage Stability | | | ||
| + | | PT-SYS02 | System End-to-End Latency | Pass | | ||
| + | </ | ||
| == Software tests == | == Software tests == | ||